Intellectual Property India Publishes Patent Application for Methods To Maintain And/Or Improve Adhesion After Anodizing Aluminum Or Titanium Substrates Bonded Together With Curable Compositions

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647092374 A) filed by Henkel AG & Co. Kgaa on July 30, 2026, for Methods To Maintain And/Or Improve Adhesion After Anodizing Aluminum Or Titanium Substrates Bonded Together With Curable Compositions.

Inventors include Steinmetz, Christian D.; Nirmalchandar, Archith; Kinney, Jordan R.; and Hu, Fengshuo.

The application for the patent was published on August 07, 2026, under issue no. 32/2026.

Abstract: Provided herein is a method of preparing a bonded anodized metal assembly, comprising the steps of: A. Providing a first metal substrate with a bonding surface and an opposite surface; B. Disposing onto at least a portion of the bonding surface of th...