Intellectual Property India Publishes Patent Application for Method Of Fabrication Of A Wafer Assembly With A Dielectric Bonding Interface

MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202641107338 A) filed by Indian Institute Of Technology Hyderabad on September 07, 2026, for Method Of Fabrication Of A Wafer Assembly With A Dielectric Bonding Interface.

Inventors include Anjani Kumar; Kuldeep Singh; Harsh Mishra; and Shiv Govind Singh.

The application for the patent was published on September 11, 2026, under issue no. 37/2026.

Abstract: The present disclosure relates to a method of fabrication of a wafer assembly with dielectric bonding interface. The method (100) includes providing first semiconductor wafer having first bonding surface and second semiconductor wafer having second bonding surface at 102. A first layer comprising...