Intellectual Property India Publishes Patent Application for Method For Cutting Silicon Wafers And Silicon Wafer

MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202617068759 A) filed by Longi Green Energy Technology Co. , Ltd. on June 01, 2026, for Method For Cutting Silicon Wafers And Silicon Wafer.

Inventors include Jia, Yongjie; Guan, Hui; Di, Daming; Cheng, Lu Number; Yang, Hao; Tang, Chenggui; and Li, Fanglin.

The application for the patent was published on July 03, 2026, under issue no. 27/2026.

Abstract: A method for cutting silicon wafers (2). The method comprises: providing a silicon rod (1) and a carrier plate (3); driving the silicon rod (1) to move downwards relative to a cutting wire (4), such that the silicon rod (1) is cut to obtain a plurality of silicon wafers (2); and lifting the silicon wa...