MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641050151 A) filed by K. Ramakrishnan College Of Engineering on April 20, 2026, for Magnetically Actuated Liquid Metal Interconnect System For Reconfigurable Motherboard Architecture.
Inventors include Rani C; Joshini K P; Kalpana T; Rithika V; and Subasri M.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: An electronic interconnect system is disclosed that enables the 5 non-destructive, reconfigurable assembly of hardware components without the use of permanent solder. The invention utilizes a microfluidic architecture embedded within a substrate, containing a conductive liquid metal alloy (such ...