MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617049212 A) filed by Shenzhen Shokz Co. , Ltd. on April 17, 2026, for Loudspeaker Assembly And Earphone.
Inventors include Zhu, Guangyuan; Zhang, Lei; and Qi, Xin.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Disclosed in the present application are a loudspeaker assembly and an earphone. The loudspeaker assembly comprises a housing assembly, an air conduction loudspeaker, and a bone conduction loudspeaker, wherein the housing assembly is provided with an accommodating space; the air conduction loudspeaker is arranged in the accommodating space; and the bone conduction loudspeaker is arranged ...