MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202641112308 A) filed by Pragati Engineering College on September 18, 2026, for Lightweight Lattice-Structured Cutting Tool With Enhanced Heat Dissipation.
Inventors include Dr. Avinash Gudimetla; Mrs. Aravinda Karri; Mrs. V. Venkata Lakshmi Dadala; and Mr. N Raghuveer.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The present invention relates to a lightweight lattice-structured cutting tool having enhanced heat dissipation for use in machining operations such as milling, turning, and drilling. The tool body is fabricated with an internal lattice core comprising a network of interconnected u...