MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202415056730 A) filed by Apple Inc. on July 25, 2024, for Integrated Gan Power Module.
Inventors include Sahoo, Ashish K.; Pierquet, Brandon; Davis, Derryk C.; Ruiz, Javier; and Brock, John M..
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: Integrated power modules according to the present technology may include a printed circuit board characterized by a first surface and a second surface. The integrated power modules may include one or more surface-mounted components coupled with the first surface of the printed circuit board. The integrated power modules may include a heat-transfer substrate. The ...