MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202648105254 A) filed by Halo Industries, Inc. on September 01, 2026, for Incident Radiation Induced Subsurface Damage For Controlled Crack Propagation In Material Cleavage.

Inventors include Iancu, Andrei, Teodor; and Rudy, Charles, William.

The application for the patent was published on September 11, 2026, under issue no. 37/2026.

Abstract: A cleaving system employs a shaper, a positioner, an internal preparation system, an external preparation system, a cleaver, and a cropper to cleave a workpiece into cleaved pieces. The shaper shapes a workpiece into a defined geometric shape. The positioner then positions the workpiece such that the internal...