MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617061564 A) filed by Spreadtrum Communications Shanghai Co. , Ltd. on May 14, 2026, for Hybrid Package-On-Package Structure.
Inventors include Liu, Mengqi; Qiu, Yuanhong; Tian, Fuyou; Yao, Li; and Chen, Si.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Provided in the present disclosure is a hybrid package-on-package structure. The package-on-package structure comprises: a memory, which has signal cells used for transmitting signals; and an adapter board, which has a first surface and a second surface arranged opposite each other, wherein the first surface faces the memory; the second surface f...