MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617068762 A) filed by Advanced Micro Devices, Inc. on June 01, 2026, for Hybrid Bonded Inverted Memory-Logic Stack.
Inventor includes Loh, Gabriel.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: Memory layers and a digital device layer are configured into a three-dimensional integrated circuit (IC) die stack. The digital device layer (304) has a first surface (side) located closest to a cooling solution (308) and the memory layers are located on a second surface (side) of the digital device layer opposite to the first surface (side) thereof. The cooling solution is adapted to receive and dissipat...