Intellectual Property India Publishes Patent Application for High Clamp Force Electrostatic Chuck For Non-Flat Substrates

MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081662 A) filed by Entegris, Inc. on July 02, 2026, for High Clamp Force Electrostatic Chuck For Non-Flat Substrates.

Inventors include Donnell, Steven; Parker, Isaac J.; Minsky, Caleb; and Rybczynski, Jakub Number.

The application for the patent was published on July 10, 2026, under issue no. 28/2026.

Abstract: An electrostatic chuck includes an electrode and a dielectric layer. When a voltage is applied to the electrode, the electrode is configured to generate an electrostatic force sufficient to flatten a non-flat substrate. The voltage applied to the electrode generates the electrostatic force sufficient to flatten the non-flat substrate s...