Intellectual Property India Publishes Patent Application for High-Bandwidth Three-Dimensional Stacked Memory With A Base Die Enabling Compute Logic Without Memory Power Grid Restrictions

MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120092 A) filed by Qualcomm Incorporated on October 07, 2026, for High-Bandwidth Three-Dimensional Stacked Memory With A Base Die Enabling Compute Logic Without Memory Power Grid Restrictions.

Inventors include Badaroglu, Mustafa; Wang, Zhongze; Kang, Woo Tag; Choi, Jihong; Lee, Hyun; Nallapati, Giridhar; and Chidambaram, Periannan.

The application for the patent was published on October 16, 2026, under issue no. 42/2026.

Abstract: A three-dimensional (3D) stacked memory package is described. The 3D stacked memory package includes a base die. The 3D stacked memory package also includes memory dies stacked on the base die. The 3D stacked memory...