MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647074541 A) filed by Hewlett-Packard Development Company, L. P. on June 16, 2026, for Heatsink System With Manifold.
Inventor includes Dowell, Daniel D..
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: A system includes an inlet, an outlet, a plurality of heatsink cells, including a first heatsink cell and a second heatsink cell, and a manifold structure to fluidically couple the plurality of heatsink cells with the inlet and the outlet. The manifold structure can include an inlet fluid connector to receive coolant from the inlet and direct the coolant into the plurality of heatsink cells, the in...