MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202544114483 A) filed by Progress Y&y Corp. on November 20, 2025, for Heat Bonding Machine.
Inventor includes Chi, Ming-.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: A heat bonding machine is configured to hot press a circuit board to be welded, and the heat bonding machine has a hot bar welding head device (10), a pressure sensor (20), and an adjustment device (30). The hot bar welding head device (10) has a hot bar head (12) and a temperature feedback wire (14). The hot bar head (12) may abut the circuit board. The temperature feedback wire (14) is configured to measure a temperature of the hot...