Intellectual Property India Publishes Patent Application for Hard Material Member, Cutting Insert, Cutting Tool, And Method For Manufacturing Cut Workpiece

MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647102053 A) filed by Kyocera Corporation on August 24, 2026, for Hard Material Member, Cutting Insert, Cutting Tool, And Method For Manufacturing Cut Workpiece.

Inventors include Iwai, Naoki; and Makino, Takahiko.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: This hard material member comprises a base body including a hard phase and a binder phase. The hard phase contains tungsten carbide and nitrogen. The binder phase contains nitrogen and at least one iron group element selected from the group consisting of iron, cobalt, and nickel. The base body has an outside portion in a range up to ...