Intellectual Property India Publishes Patent Application for Functionally Graded Conductive Interlayer For Mesh-Free Resistance Welding Of Metallic–thermoplastic Sandwich Structures

MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202641093416 A) filed by Dr. Swarna S; K. S. School Of Engineering And Management; and Dr. Santhosh N on July 31, 2026, for Functionally Graded Conductive Interlayer For Mesh-Free Resistance Welding Of Metallic–thermoplastic Sandwich Structures.

Inventors include Dr. Swarna S; K. S. School Of Engineering And Management; and Dr. Santhosh N.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: The present invention relates to a functionally graded conductive interlayer for mesh-free resistance welding of metallic–thermoplastic sandwich structures. The sandwich structure comprises upper and lower metal...