Intellectual Property India Publishes Patent Application for Foldable Substrates, Foldable Articles, And Methods Of Making The Same

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617096894 A) filed by Corning Incorporated on August 11, 2026, for Foldable Substrates, Foldable Articles, And Methods Of Making The Same.

Inventors include Deng, Huayun; Kiczenski, Timothy James; Lynn, Jeffrey Glenn; and Wang, Chuanche.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: Foldable substrates have a first portion, a second portion, and a central portion positioned therebetween. The first portion and the second portion have a substrate thickness less than a central thickness of the central portion. A plurality of protrusions extend from a first central surface area of the central port...