MUMBAI, India, Nov. 6 -- Intellectual Property India has published a patent application (202641015867 A) filed by Presidency University, Bangalore on February 12, 2026, for Foam Shaping And Cutting Device.
Inventor includes Dr. Yamanappa.
The application for the patent was published on November 06, 2026, under issue no. 45/2026.
Abstract: A foam shaping and cutting device, comprises of a platform 101 with suction cups 102 to adhere the platform 101 over the surface, a plate 104 on each lateral side of the platform 101 to support foam blocks, an input means 103 linked to a microcontroller for input commands regarding initiation of a foam shaping and cutting operation, a rotatable imaging unit 105 for determining the alignment and orientat...