MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202631111072 A) filed by Indian Institute Of Technology Indian School Of Mines, Dhanbad on September 16, 2026, for Flow-Controlled Meshed Channel-Based Site-Specific Substrate Cooling System For Welding Or Waam Applications.
Inventors include Md Sajid Hussain; Raushan Kumar; Vishal Kumar; Manoranjan Kumar Mahto; and Amitava Mandal.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A flow-controlled meshed channel-based substrate cooling system for welding or wire arc additive manufacturing (WAAM) applications comprises a refrigeration unit (101), a circulation pump (102), and a substrate cooling ...