Intellectual Property India Publishes Patent Application for Flexible Cover-Lay Stencil Technique For Selective Filling Of Through –via Using Room Temperature Vulcanized Silicon Paste In Solder Finished High Density Pcbs For High Reliability Electronics Applications

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202641094203 A) filed by Indian Space Research Organization on August 04, 2026, for Flexible Cover-Lay Stencil Technique For Selective Filling Of Through –via Using Room Temperature Vulcanized Silicon Paste In Solder Finished High Density Pcbs For High Reliability Electronics Applications.

Inventors include Amrendra Pratap Singh; Hanumanth Rao C.; Selvan C; Shivanandayya S. A.; Sujitha K. N; Shriram N Bhat; Selvi R; and James M P.

The application for the patent was published on August 07, 2026, under issue no. 32/2026.

Abstract: ABSTRACT OF THE INVENTION Flexible Cover-lay Stencil Technique for Selective Filling of Through –via using Room temperatur...