Intellectual Property India Publishes Patent Application for Finishing On Packaging Substrate With Ultra High-Density Interconnects

MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202647114326 A) filed by Applied Materials, Inc. on September 24, 2026, for Finishing On Packaging Substrate With Ultra High-Density Interconnects.

Inventors include Verhaverbeke, Steven; Chen, Han-Wen; Park, Giback; Zheng, Kai; Leschkies, Kurtis Siegfried; Houk, Roman; Iyer, Subramanian Srikanteswara; and Harish, Vineeth.

The application for the patent was published on October 02, 2026, under issue no. 40/2026.

Abstract: A packaging substrate is provided. The packaging substrate includes a core and first organic buildup layers on a first side of the core. The first organic buildup layers include an organic dielectric material and at least one of fir...