MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617064355 A) filed by Vanchip Tianjin Technology Co. , Ltd. on May 21, 2026, for Filter Packaging Structure And Manufacturing Method Therefor.
Inventor includes Su, Xiaoyu.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Provided in the present invention is a manufacturing method for a filter packaging structure. The manufacturing method comprises: providing a carrier plate having a roof structure formed on a surface, wherein the roof structure comprises a roof attached to the surface of the carrier plate and a supporting wall located on the roof; providing a substrate having a resonant structure ...