MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127775 A) filed by Acm Research Shanghai; Inc. on October 27, 2026, for Electroplating Chuck For Square Substrate And Electroplating Method.
Inventors include Wang, Hui; Wang, Jian; Jia, Zhaowei; Yang, Hongchao; Diao, Jianhua; and Xiao, Yan.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: Provided in the present invention is an electroplating chuck for a square substrate, comprising: a substrate chuck plate, which has an inner edge for supporting a substrate; a pressing plate, which is arranged above the substrate chuck plate, wherein a guide post is provided between the substrate chuck plate...