MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647078939 A) filed by Samsung Electronics Co. , Ltd. on June 26, 2026, for Electronic Device Comprising Printed Circuit Board Having Fill-Cut Part.
Inventors include Lee, Seunghyuk; Yun, Cheongno; Lee, Sangjun; Lee, Soojung; Lee, Wonsun; Lee, Pyeonghee Number; and Jung, Dongkeun.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: This electronic device comprises: a housing; a camera in the housing, arranged at the edge of the electronic device; a speaker arranged beside the camera; and a PCB including an opening part in which the speaker is accommodated, and a neck end part between the speaker and the...