MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202617076250 A) filed by Samsung Electronics Co. , Ltd. on June 19, 2026, for Electronic Device Comprising Ground Structure Of Conductive Layer.
Inventors include Kim, Hyunsoo; Lee, Jongwon; Kim, Sangjun; Kim, Sujung Number; Bae, Hankook; Chung, Myungkyoon; and Choi, Taekkyun.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: This electronic device may comprise: a bracket; printed circuit board; integrated circuitry (IC) electrically connected to at least another component of the electronic device through the printed circuit board; a shield member which is disposed on the IC and the printed circuit boa...