MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202611101146 A) filed by Jawaaz Ahmad; Shahkar Ahmad Nahvi; Basharat Nabi Dar; and Design Innovation Centre, Islamic University Of Science And Technology on August 21, 2026, for Eco-Friendly Packaging System Using Biodegradable Compressed Husk Panels.
Inventors include Jawaaz Ahmad; Shahkar Ahmad Nahvi; and Basharat Nabi Dar.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: The present invention relates to an eco-friendly packaging system utilizing biodegradable compressed husk panels as a sustainable substitute for plastic and thermocol. The system converts agricultural residues such as rice husk o...