MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202641122303 A) filed by Arunachala College Of Engineering For Women on October 13, 2026, for Eco-Friendly Low-Density Packaging Foam Developed From Banana Stem Agricultural Waste.
Inventors include Shivani. A; Suvanthi. L; Nivethitha. D; and Dr. R. Ablin.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present invention relates to an eco-friendly low-density packaging foam developed from banana stem agricultural waste, which provides a sustainable alternative to conventional petroleum-based packaging materials such as expanded polystyrene (EPS). The invention utilizes discarded banana stem or ...