Intellectual Property India Publishes Patent Application for Dual-Side Gan- And Graphene-Functionalized Polycrystalline Diamond Wafer And Fabrication Method

MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202621098927 A) filed by Hetalben Hirenkumar Savaliya; and Hirenkumar Vallabhbhai Savaliya on August 16, 2026, for Dual-Side Gan- And Graphene-Functionalized Polycrystalline Diamond Wafer And Fabrication Method.

Inventor includes Hirenkumar Vallabhbhai Savaliya.

The application for the patent was published on October 02, 2026, under issue no. 40/2026.

Abstract: A dual-side functionalized semiconductor wafer (100) comprises a monolithic polycrystalline-diamond body (102) of 70-200 mm diameter (206) carrying a GaN- compatible functional interface (108) at a first surface (104) and a graphene-based layer (110) on an opposing second surface (106). An ins...