Intellectual Property India Publishes Patent Application for Development Of New Suture Material (kevcarb)over The Lacerated Wounds And Over The Joints To Prevent Wound Gapping

MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202641072899 A) filed by Saveetha Institute Of Medical And Technical Sciences on June 12, 2026, for Development Of New Suture Material (kevcarb)over The Lacerated Wounds And Over The Joints To Prevent Wound Gapping.

Inventors include Dr Vidhyaalakshmi S; Dr Venkatesh G; and Deepak Nallaswamy Veeraiyan.

The application for the patent was published on June 26, 2026, under issue no. 26/2026.

Abstract: Suturing over joints is a very challenging one as it is prone for wound dehiscence owing t the flexion, extension and other movements of the joints. In this study, we propose development of a new suture material combining Kevlar ( para armid) and carbon f...