MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202641077236 A) filed by Devi S; and Yuvarani S on June 23, 2026, for Development Of Antimicrobial Agro-Waste Reinforced Sandwich Panel For Sustainable Insulated Packagin.
Inventors include Devi S; and Yuvarani S.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The increasing demand for sustainable and eco-friendly packaging materials has led to the exploration of agricultural waste as a valuable reoource. The pre:;ent study focuses on the development of antimicrobial agro-waste reinforced sandwich panels for insulated pockaging applications. The panels are fabricated using agro-waste fibers such as b...