Intellectual Property India Publishes Patent Application for Copper-Based Metal Matrix Hybrid Composites Reinforced With Recycled Stainless Steel Chips For Enhanced Friction And Wear Performance

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202611115970 A) filed by Graphic Era Deemed To Be University on September 28, 2026, for Copper-Based Metal Matrix Hybrid Composites Reinforced With Recycled Stainless Steel Chips For Enhanced Friction And Wear Performance.

Inventors include Manvandra Kumar Singh; and Gopal Ji.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: The invention relates to copper-based metal matrix hybrid composites and stir-casting methods for producing bulk engineering materials. A copper matrix is reinforced with waste stainless steel chips in an amount of 1 wt.% to 4 wt.%, together with tungsten carbide and chromium at...