Intellectual Property India Publishes Patent Application for Copper Alloy Sheet Material, Method For Producing Same, And Current-Carrying Component

MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202547090770 A) filed by Dowa Metaltech Co. , Ltd. on September 23, 2025, for Copper Alloy Sheet Material, Method For Producing Same, And Current-Carrying Component.

Inventors include Miyahara Ryosuke; Sasai Yuta; and Aoyama Tomotsugu.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: [Problem] To provide a Cu-Fe-P-based copper alloy sheet material which exhibits excellent strength and electrical conductivity and also has a higher level of bending workability. [Solution] Provided is a copper alloy sheet material which has a chemical composition containing, in terms of mass%, 0.05-1.10% of Fe, 0.0...