Intellectual Property India Publishes Patent Application for Coordination Between Mac Layer Harq And Rlc Transmissions

MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202647122483 A) filed by Qualcomm Incorporated on October 13, 2026, for Coordination Between Mac Layer Harq And Rlc Transmissions.

Inventor includes He, Linhai.

The application for the patent was published on October 23, 2026, under issue no. 43/2026.

Abstract: Method and apparatus for coordination between HARQ and RLC transmissions. A UE receives, from a network entity, an indication that a HARQ process has failed or terminated for a MAC layer. The UE initiates, at a RLC layer, a retransmission of RLC PDUs in response to receipt of the indication that the HARQ process has failed or terminated for the MAC layer.

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