MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202511103446 A) filed by Carevego Solutions Private Limited on October 27, 2025, for Cooling Assembly.
Inventors include Aashish; Gadre, Dr. Dhananjay V.; and Prashant.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A cooling assembly (100) for maintaining a substance at a target temperature, includes at least one thermoelectric cooling (TEC) module (105), each TEC module (105) including a cold side (105a) and a hot side (105b). A heat sink (115) is thermally coupled to the hot side (105b) of the TEC module (105) and a fan (120) is configured to dissipate heat from the heat sink (115). First, ...