Intellectual Property India Publishes Patent Application for Cooling Arrangement For A Thermoelectric Cooling Module

MUMBAI, India, Aug. 31 -- Intellectual Property India has published a patent application (202421096844 A) filed by Vertiv Corporation on December 07, 2024, for Cooling Arrangement For A Thermoelectric Cooling Module.

Inventors include Srinivasan Natarajan; Pramod Dalvi; Utkarsh Diliprao Charapale; and Kishan Jaysukh-Bhai Jethva.

The application for the patent was published on August 28, 2026, under issue no. 35/2026.

Abstract: ABSTRACT COOLING ARRANGEMENT FOR A THERMOELECTRIC COOLING MODULE A cooling system for a TEC module (56) may include a cold plate (102) including a base (104) and a top body (106) mounted thereon at a predetermined distance from the base (104), where the base (104) and the top body (106) may be configured to create ...