Intellectual Property India Publishes Patent Application for Conductive Structure And Interconnects For Electrically Connecting A Substrate And An Interposer

MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647120089 A) filed by Qualcomm Incorporated on October 07, 2026, for Conductive Structure And Interconnects For Electrically Connecting A Substrate And An Interposer.

Inventors include Patil, Aniket; Wang, Zhijie; and Buot, Joan Rey Villarba.

The application for the patent was published on October 16, 2026, under issue no. 42/2026.

Abstract: A device includes a substrate, an interposer, a die disposed between the substrate and the interposer, and a conductive structure disposed between the substrate and the interposer. The conductive structure includes one or more walls defining one or more openings. The one or more walls are electrically connect...