MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617098208 A) filed by Micromax Us Holdings LLC on August 13, 2026, for Conductive Paste And Sintering Methods.
Inventor includes Saga, Yuji.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: A conductive paste is provided. The conductive paste includes a metal particulate material having a first metal powder having a having a D50 ranging from about 500 nm to about 1,500 nm, a second metal powder having a D50 ranging from about 10 nm to about 100 nm, and a third metal powder having a D50 ranging from about 3,000 nm to about 5,500 nm. The metal paste includes a solvent composition. The weight ratio ...