MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617089678 A) filed by Kao Corporation on July 23, 2026, for Composition For Mold.
Inventors include Tanaka,hiroki; Matsuo,toshiki; and Yamaguchi,daisuke.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: The present invention pertains to a composition for a mold, the composition comprising an acid-curable resin, a curing agent for curing the acid-curable resin, and refractory particles, wherein the curing agent contains an aromatic sulfonic acid (A), and the average total number of carbon atoms, per molecule of the aromatic sulfonic acid (A), of an alkyl group of the aromatic sulfonic acid (A) co...