MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647066731 A) filed by Nippon Soda Co. , Ltd. on May 27, 2026, for Composition For Insulating Layer Of Printed Wiring Board.
Inventors include Kawanishi, Takuya; Yamate, Taiki; Saito, Mizuki; and Shibata, Yasuhisa.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: The present invention addresses the problem of providing a composition for use in an insulating layer of a printed wiring board, said composition having a low dielectric constant, a low dielectric loss tangent, and flame retardancy. This resin composition for use in an insulating layer of a printed wiring board includes a polybutadiene, whe...