Intellectual Property India Publishes Patent Application for Composite Material System With Enhanced Mechanical And Thermal Properties

MUMBAI, India, Nov. 6 -- Intellectual Property India has published a patent application (202641131500 A) filed by Meenakshi Sundararajan Engineering College Autonomous on November 03, 2026, for Composite Material System With Enhanced Mechanical And Thermal Properties.

Inventors include Dr. S. V. Saravanan; Dr. Raja M A; Mr. Brithivi Raj. G; Mr. K. Rajkumar; Dr. S. Kamatchisankaran; Mr. Iyyanar K; Dr. T. Prabakaran; and Mr. Daniel Asirvatham A.

The application for the patent was published on November 06, 2026, under issue no. 45/2026.

Abstract: ABSTRACT COMPOSITE MATERIAL SYSTEM WITH ENHANCED MECHANICAL AND THERMAL PROPERTIES 5 10 The present invention relates to a composite material system comprising a polymer matrix, reinforcing fibres,...