MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202521004817 A) filed by Lsp Innovations LLP on January 21, 2025, for Cold-Cum-Cold-Proof Panels, Accessories And Uses Thereof.
Inventors include Dharmaraj N. Patil; Chetan Dharmaraj Patil; and Supriya Dharmaraj Patil.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: ABSTRACT Cold-cum-cold-proof panels, accessories and their installation The invention relates to a cold-cum-cold-proof panel (100) comprising one or more baked clay hollow core panels having one or more hollow cores, water inlets (2) and/or water outlets (3). In particular, the panels may include hollow core clay blocks (8, 9, 10), hollow...