Intellectual Property India Publishes Patent Application for Closure-Gated Fracture-Relay Coupling Link For Cascaded Solderless Assembly Of Electromechanical Modules

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202641126246 A) filed by Bapatla Surendra Babu; and Irukumalli Priyanka on October 23, 2026, for Closure-Gated Fracture-Relay Coupling Link For Cascaded Solderless Assembly Of Electromechanical Modules.

Inventors include Bapatla Surendra; and Irukumalli Priyanka.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: CLOSURE-GATED FRACTURE-RELAY COUPLING LINK FOR CASCADED SOLDERLESS ASSEMBLY OF ELECTROMECHANICAL MODULES A coupling link (100) joins two modules without solder or tools. A frangible glass fuse (110) holds, through a latch lever (136), a spring-loaded jaw (104) open on a base frame (102). When...