Intellectual Property India Publishes Patent Application for Chip Package With Active Silicon Bridge

MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202647068618 A) filed by Advanced Micro Devices, Inc. on June 01, 2026, for Chip Package With Active Silicon Bridge.

Inventors include Kulkarni, Deepak Vasant; Smith, Alan D.; and Swaminathan, Raja.

The application for the patent was published on June 12, 2026, under issue no. 24/2026.

Abstract: Disclosed herein are chip packages and electronic devices that utilized an active silicon bridge having a memory controller to interface between a logic device having at least one compute die and one or more memory stacks within a singular chip package. In one example, a chip package is provided that includes a substrate, a logic device, a memory stack, and ...