Intellectual Property India Publishes Patent Application for Cap Application Device And Method For Applying Caps To Sealed Packages

MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202647102041 A) filed by Tetra Laval Holdings & Finance S. A. on August 24, 2026, for Cap Application Device And Method For Applying Caps To Sealed Packages.

Inventors include Bellesia, Simone; Bortolotti, Edoardo; and Marino, Alessandro.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: There is described a cap application device (14) for a capping apparatus (13) of a packaging machine (1) configured to produce sealed packages (2) containing a pourable product and each provided with a respective pouring collar (5), the cap application device (14) is configured to apply caps (6) onto the respecti...