Intellectual Property India Publishes Patent Application for Apparatus, System, And Method For Distributing Die-Specific Signals Across Die Stacks

MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647084317 A) filed by Advanced Micro Devices, Inc. on July 09, 2026, for Apparatus, System, And Method For Distributing Die-Specific Signals Across Die Stacks.

Inventors include Schreiber, Russell; Wuu, John; Lakshman, Shravan; Wingfield, James Number; Johnson, Brett Lance; and Threatt, Vance.

The application for the patent was published on July 10, 2026, under issue no. 28/2026.

Abstract: An exemplary apparatus for distributing die-specific signals across die stacks includes a die stack and a plurality of signals arranged in a sequence across the die stack. The plurality of signals shift positions in the sequence between a first die and a second...