MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647066422 A) filed by Qualcomm Incorporated on May 26, 2026, for Aggregated Capability Signaling For Carrier Aggregation And Dual Connectivity Modes.
Inventors include Han, Bin; Kitazoe, Masato; Agrawal, Mona; and Cao, Yiqing.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may transmit an aggregated capability message for communications between the UE and a network entity via a set of component carriers. Further, the aggregated capability message may indicate a total processing capability of the UE for ...