MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202617066681 A) filed by Nihon Parkerizing Co. , Ltd. on May 27, 2026, for Adhesive For Resin Material Having Low Dielectric Properties, And Laminate.
Inventors include Nakahara,takahiro; and Izumi,mayuko.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Provided is an adhesive for a resin material having low dielectric properties that is excellent in adhesiveness between a metal material (especially a metal material having a low surface roughness) and a resin material having low dielectric properties. Provided is an adhesive for bonding a metal material and a resin material having low dielectric prop...