MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617061433 A) filed by Nissan Chemical Corporation on May 14, 2026, for Adhesive Composition, Laminate, And Method For Manufacturing Processed Semiconductor Substrate.
Inventors include Okuno Takahisa; Yanai Masaki; Usui Yuki; and Shinjo Tetsuya.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: Provided is an adhesive composition for forming an adhesive layer to be used in temporarily bonding a semiconductor substrate or an electronic device layer and a support substrate, wherein: after the semiconductor substrate or the electronic device layer and the support substrate are temporarily bonded via th...