Intellectual Property India Publishes Patent Application for Adaptive Multi-Layer Thermal Management System And Method For High-Density System-On-Chip (soc) Devices

MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202611106584 A) filed by Dr. Akanksha Gupta; Dr. S. Kannadhasan; Ms. Aparna Gunvant Raut; Mrs. Minakshi V. Umate; Dr. G. Prabha; Dr. K. Pravinkumar; and Premkumar R on September 04, 2026, for Adaptive Multi-Layer Thermal Management System And Method For High-Density System-On-Chip (soc) Devices.

Inventors include Dr. Akanksha Gupta; Dr. S. Kannadhasan; Ms. Aparna Gunvant Raut; Mrs. Minakshi V. Umate; Dr. G. Prabha; Dr. K. Pravinkumar; and Premkumar R.

The application for the patent was published on October 16, 2026, under issue no. 42/2026.

Abstract: An adaptive multi-layer thermal management system and method for a high-density System-on-Chip (SoC)...