Intellectual Property India Publishes Patent Application for A Multi-Protocol Communication Interface For Embedded Platforms

MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202611064322 A) filed by Noida Institute Of Engineering & Technology on May 21, 2026, for A Multi-Protocol Communication Interface For Embedded Platforms.

Inventors include Dr. Akanksha Singh; and Bhawna Khullar.

The application for the patent was published on July 17, 2026, under issue no. 29/2026.

Abstract: A multi-protocol communication interface for embedded platforms is disclosed. The interface includes protocol ports, protocol adaptation modules, a shared buffer fabric, an arbitration and scheduling unit, a timing alignment unit, a security and validation module, a diagnostic and recovery unit, and a platform interface controller. Protocol-spe...